General informationModel number
X3450Frequency (MHz)
2667Clock multiplier
20Package1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)SocketSocket 1156 (LGA1156)
Architecture / MicroarchitectureCore steppingB1 (SLBLD)Manufacturing process0.045 micronData width64 bitNumber of cores4Floating Point UnitIntegratedLevel 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data cachesLevel 2 cache size
4 x 256 KBLevel 3 cache size8 MBMultiprocessingUniprocessorFeatures
Low power features
On-chip peripherals
Electrical/Thermal parametersV core (V)
0.65 - 1.4Minimum operating temperature (°C)5Maximum power dissipation (W)
189.78 (peak)
160.08 (sustained)Thermal Design Power (W)
95
General informationModel number
X3450Frequency (MHz)
2667Clock multiplier
20Package1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)SocketSocket 1156 (LGA1156)
Architecture / MicroarchitectureCore steppingB1 (SLBLD)Manufacturing process0.045 micronData width64 bitNumber of cores4Floating Point UnitIntegratedLevel 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data cachesLevel 2 cache size
4 x 256 KBLevel 3 cache size8 MBMultiprocessingUniprocessorFeatures
Low power features
On-chip peripherals
Electrical/Thermal parametersV core (V)
0.65 - 1.4Minimum operating temperature (°C)5Maximum power dissipation (W)
189.78 (peak)
160.08 (sustained)Thermal Design Power (W)
95