Intel® Xeon® Quad-Core X3470, 2.93 GHz, 8M Cache, Turbo, HT

General information
Model number	X3470
Frequency (MHz)	2933
Clock multiplier	22
Package	1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket	Socket 1156 (LGA1156)

Architecture / Microarchitecture
Core stepping	B1 (SLBJH)
Manufacturing process	0.045 micron
Data width	64 bit
Number of cores	4
Floating Point Unit	Integrated
Level 1 cache size	4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size	4 x 256 KB
Level 3 cache size	8 MB
Multiprocessing	Uniprocessor
Features	MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit Turbo Boost Technology Trusted Execution Technology Hyper-Threading technology
Low power features	Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology
On-chip peripherals	Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface

Electrical/Thermal parameters
V core (V)	0.65 - 1.4
Minimum operating temperature (°C)	5
Maximum power dissipation (W)	189.78 (peak) 160.08 (sustained)
Thermal Design Power (W)	95

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General information
Model number	X3470
Frequency (MHz)	2933
Clock multiplier	22
Package	1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket	Socket 1156 (LGA1156)

Architecture / Microarchitecture
Core stepping	B1 (SLBJH)
Manufacturing process	0.045 micron
Data width	64 bit
Number of cores	4
Floating Point Unit	Integrated
Level 1 cache size	4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size	4 x 256 KB
Level 3 cache size	8 MB
Multiprocessing	Uniprocessor
Features	MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit Turbo Boost Technology Trusted Execution Technology Hyper-Threading technology
Low power features	Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology
On-chip peripherals	Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface

Electrical/Thermal parameters
V core (V)	0.65 - 1.4
Minimum operating temperature (°C)	5
Maximum power dissipation (W)	189.78 (peak) 160.08 (sustained)
Thermal Design Power (W)	95