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General information | |||||||||
Type | CPU / Processor | ||||||||
Market segment | Server | ||||||||
Family | Intel Xeon 3600 | ||||||||
Model number | W3670 | ||||||||
CPU part numbers | AT80613005490AC is an OEM/tray microprocessor BX80613W3670 is a boxed microprocessor |
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Frequency (MHz) | 3200 | ||||||||
Turbo frequency (MHz) | 3467 | ||||||||
Bus speed (MHz) | 2400 MHz QPI | ||||||||
Clock multiplier | 24 | ||||||||
Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) | ||||||||
Socket | Socket 1366 (LGA 1366) | ||||||||
Size | 1.77" x 1.67" / 4.5cm x 4.25cm | ||||||||
S-spec numbers | |||||||||
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Architecture / Microarchitecture | |||||||||
Platform | Tylersburg-WS | ||||||||
Core stepping | B1 (SLBVE) | ||||||||
Manufacturing process | 0.032 micron High-K metal gate process | ||||||||
Data width | 64 bit | ||||||||
Number of cores | 6 | ||||||||
Floating Point Unit | Integrated | ||||||||
Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
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Level 2 cache size | 6 x 256 KB | ||||||||
Level 3 cache size | 12 MB | ||||||||
Physical memory (GB) | 24 | ||||||||
Multiprocessing | Uniprocessor | ||||||||
Features |
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Low power features | Enhanced SpeedStep technology | ||||||||
On-chip peripherals |
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Electrical/Thermal parameters | |||||||||
V core (V) | 0.8 - 1.375 | ||||||||
Maximum operating temperature (°C) | 67.9 | ||||||||
Thermal Design Power (W) | 130 | ||||||||
Notes on Intel AT80613005490AC | |||||||||
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General information | |||||||||
Type | CPU / Processor | ||||||||
Market segment | Server | ||||||||
Family | Intel Xeon 3600 | ||||||||
Model number | W3670 | ||||||||
CPU part numbers | AT80613005490AC is an OEM/tray microprocessor BX80613W3670 is a boxed microprocessor |
||||||||
Frequency (MHz) | 3200 | ||||||||
Turbo frequency (MHz) | 3467 | ||||||||
Bus speed (MHz) | 2400 MHz QPI | ||||||||
Clock multiplier | 24 | ||||||||
Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) | ||||||||
Socket | Socket 1366 (LGA 1366) | ||||||||
Size | 1.77" x 1.67" / 4.5cm x 4.25cm | ||||||||
S-spec numbers | |||||||||
|
|||||||||
Architecture / Microarchitecture | |||||||||
Platform | Tylersburg-WS | ||||||||
Core stepping | B1 (SLBVE) | ||||||||
Manufacturing process | 0.032 micron High-K metal gate process | ||||||||
Data width | 64 bit | ||||||||
Number of cores | 6 | ||||||||
Floating Point Unit | Integrated | ||||||||
Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
||||||||
Level 2 cache size | 6 x 256 KB | ||||||||
Level 3 cache size | 12 MB | ||||||||
Physical memory (GB) | 24 | ||||||||
Multiprocessing | Uniprocessor | ||||||||
Features |
|
||||||||
Low power features | Enhanced SpeedStep technology | ||||||||
On-chip peripherals |
|
||||||||
Electrical/Thermal parameters | |||||||||
V core (V) | 0.8 - 1.375 | ||||||||
Maximum operating temperature (°C) | 67.9 | ||||||||
Thermal Design Power (W) | 130 | ||||||||
Notes on Intel AT80613005490AC | |||||||||
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